Mechanical Stress and Electromigration Failure-Reference-Cited by-同舟云学术

Mechanical Stress and Electromigration Failure

Published:1991 Issue: Volume:225 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Lloyd J. R.

Abstract

ABSTRACTThe role of mechanical stress in electromigration failure morphology and time to failure is discussed theoretically. It is seen that a tensile stress can accelerate failure significantly and that accelerations from test conditions are also a function of applied stress.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference13 articles.

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2. DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS

3. 11) Kwok T. , Chan K.K. , Chan H. and Simko J. , To be published in J. Appl. Phys. July/August 1991

4. Electromigration failure

5. Electromigration Damage in Thin Films due to Grain Boundary Grooving Processes

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