A Two Step Rapid Thermal Annealing Process for Be Implant Activation in GaAs

Abstract

SUMMARY ABSTRACTA two step rapid thermal anneal (RTA) has been studied for activating Be implanted GaAs, where a short duration, high temperature step is used to electrically activate the Be followed by a longer, low temperature anneal for lattice regrowth. p-n diodes show a substantial reduction in reverse diode leakage current after the low temperature second step anneal, when compared to a single step RTA or to furnace annealing (FA). For low energy Be implants, no difference in elecrical activiation between the two step anneal is observed. Raman studies demonstrate that residual substrate impurities and high Be concentrations inhibit restoration of single crystal lattice characteristics after RTA. Lattice quality is shown not to limit diode characteristics in the RTA material.