Rapid Thermal Annealing of III–V Compound Materials

Author:

Kuzuhara M.,Kohzu H.,Takayama Y.

Abstract

ABSTRACTRapid thermal process utilizing radiation from halogen lamps has been used to post-anneal ion-implanted GaAs. Annealing conditions for Si implants in GaAs are discussed from the view point of applying this technique to GaAs MESFET fabrication. Also, the properties of S and Mg implants in GaAs followed by rapid thermal annealing are comparatively studied with the results after conventional furnace annealing. High electrical activation and minimized implant diffusion for both low and high dose implants are the principal features of this technique. The fabricated MESFET showed much higher transconductance without any anomalous characteristics, indicating this technique to be a promising alternative to conventional furnace annealing.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference19 articles.

1. 19. Inada T. , Tatsuta S. , Okamura S. , Muto S. , and Hiyamizu S. , The 44th Autumn Meeting of the Japan Society of Appl. Phys. (1983) p.471 (in Japanese).

2. 17. Kuzuhara M. , and Kohzu H. , submitted for publication.

3. Redistrubution of Zn Implanted into GaAs

4. Electric properties and distribution of sulfur implants in GaAs

5. Electron beam annealing of selenium‐implanted gallium arsenide

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