Solid Air—Low Temperature Manufacturing of Ultra-Low Permittivity Composite Materials for Future Telecommunication Systems-Reference-Cited by-同舟云学术

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Solid Air—Low Temperature Manufacturing of Ultra-Low Permittivity Composite Materials for Future Telecommunication Systems

Published:2019-05-03 Issue: Volume:6 Page:
ISSN:2296-8016
Container-title:Frontiers in Materials
language:
Short-container-title:Front. Mater.

Author:

Nelo Mikko,Liimatainen Henrikki,Väätäjä Maria,Ukkola Jonne,Juuti Jari,Jantunen Heli

Funder

European Research Council

Academy of Finland

Publisher

Frontiers Media SA

Subject

Materials Science (miscellaneous)

Reference25 articles.

1. Permittivity of LTCC substrates porousified with a wet chemical etching process;Bittner;Proce Eng,2010

2. 2018

3. Advances in ultra low dielectric constant ordered porous materials;Farrell;Electrochem. Soc. Interface Winter,2011

4. Hollow glass microspheres coated with CoFe2O4 and its microwave absorption property;Fu;J. Magn. Magn. Mater,2007

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