Ultra-low permittivity ULTCC composite materials
Author:
Affiliation:
1. Microelectronics Research Unit, University of Oulu, P. O. Box 4500, FI-90014, Finland
Funder
H2020 European Research Council
Academy of Finland
European Regional Development Fund
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0048566
Reference27 articles.
1. Ultralow-Dielectric-Constant Films Prepared from Hollow Polyimide Nanoparticles Possessing Controllable Core Sizes
2. Solid Air—Low Temperature Manufacturing of Ultra-Low Permittivity Composite Materials for Future Telecommunication Systems
3. Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material
4. Nanoporous Ultra-Low-κ Films Prepared from Fluorinated Polyimide with Grafted Poly(acrylic acid) Side Chains
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