An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

Author:

Li Ming,Guo Xiaoguang,Yuan Song,Zhao Bingyao,Qi Yongnian,Zhang Shuohua,Guo Dongming,Zhou PingORCID

Abstract

Understanding the influence mechanism of abrasive/tool wear on machining is the key to realize high-efficiency ultra-precision machining of fused silica. To explore the effect of abrasive/tool wear on ductile machining, the smoothed particle hydrodynamics (SPH) cutting models with different edge radii are established. Through the analysis of equivalent rake angle, hydrostatic pressure, cutting force and maximum principal stress with the Flamant’s formula, the influence of edge radii on ductile-brittle transition (DBT) is discussed for the first time. The simulation results show that when the edge radius increases from less to larger than the cutting depth, the equivalent rake angle changes from positive to negative, and the maximum hydrostatic pressure gradually increases, which is beneficial to promote the ductile processing. Meanwhile, with the rise of edge radius (i.e., abrasive/tool wear), both the cutting force and crack initiation angle increase, while the friction coefficient and normalized maximum principal decrease. When the value of normalized maximum principal stress exceeds 2.702, the crack in the workpiece begins to initiate, and its initiation angle calculated by the Flamant’s formula is in good agreement with the simulation results as well as less than 50°. Finally, the nano-scratch experiment was carried out, and the material removal mechanism and friction coefficient f similar to the simulation were obtained, which further proved the accuracy of SPH model. This study is meaningful for understanding the effect of abrasive/tool wear on the removal mechanism of brittle materials and improving the quality and efficiency of cutting and grinding.

Funder

National Natural Science Foundation of China

Science Fund for Creative Research Groups of NSFC of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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