Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions-Reference-Cited by-同舟云学术

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Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions

Published:2016-10 Issue: Volume:109 Page:126-136
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Wang Wei,Yao Peng,Wang Jun,Huang Chuanzhen,Zhu Hongtao,Zou Bin,Liu Hanlian,Yan Jiwang

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference29 articles.

1. Surface evolution and laser damage resistance of CO2, laser irradiated area of fused silica;Dai;Opt. Lasers Eng.,2011

2. Material removal mechanisms in lapping and polishing;Evans;CIRP Ann. – Manuf. Technol.,2003

3. A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials;Arif;Int. J. Mach. Tools Manuf.,2013

4. Ultra-precision grinding;Brinksmeier;CIRP Ann. – Manuf. Technol.,2010

5. Study on ductile-mode mirror grinding of sic ceramic freeform surface using an elliptical torus-shaped diamond wheel;Xie;J. Mater. Process. Technol.,2015

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2. Temperature field in the crack-free ductile dry grinding of fused silica based on wheel wear topographies;Journal of Materials Processing Technology;2024-11

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