Temperature field in the crack-free ductile dry grinding of fused silica based on wheel wear topographies-Reference-Cited by-同舟云学术

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Temperature field in the crack-free ductile dry grinding of fused silica based on wheel wear topographies

Published:2024-11 Issue: Volume:332 Page:118552
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Wang Wei,Li Zhipeng,Yin Hang,Chen Shuo,Yu Shimeng,Yao Peng

Funder

National Natural Science Foundation of China

Natural Science Basic Research Program of Shaanxi Province

National Aerospace Science Foundation of China

Department of Science and Technology of Shandong Province

Publisher

Elsevier BV

Reference39 articles.

1. Ultra-precision grinding of optical glass lenses with La-doped CeO2 slurry;Kakinuma;CIRP Ann. -Manuf. Technol.,2019

2. J Manufacturing and measurement of freeform optics;Fengzhou;CIRP Ann. -Manuf. Technol.,2013

3. Ultra-precision grinding;Brinksmeier Ekkard;CIRP Ann. Manuf. Technol.,2010

4. Elastic stress field model and micro-crack evolution for isotropic brittle materials during single grit scratching;Wang;Ceram. Int.,2017

5. Towards understanding the crack suppression mechanism in brittle materials with high grinding speed at different temperatures;Zhang;Int. J. Mach. Tools Manuf.,2023

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