Research on a Super-Sub-Arc Bivariate Relative Angle Thermal Deformation Testing Method without Pitch Angle Limitation

Author:

Liu Yang12,Xue Yaoke1234,Wang Hu1256,Pan Yue12,Lin Shangmin12,Ye Shuifu12,Liu Jie12

Affiliation:

1. Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an 710119, China

2. Xi’an Space Sensor Optical Technology Engineering Research Center, Xi’an 710119, China

3. Youth Innovation Promotion Association of Chinese Academy of Sciences, Beijing 100037, China

4. School of Instrumentation Science and Optoelectronic Engineering, Beihang University, Beijing 100191, China

5. University of Chinese Academy of Sciences, Beijing 100049, China

6. Laboratory of Sciences Space Precision Measurement Technology of Chinese Academy of Sciences, Xi’an 710119, China

Abstract

In light of the current situation where no testing equipment is available for measuring thermal deformation of objects, this paper proposes a novel method for accurate and precise measurement. The method overcomes the limitations of previous approaches that relied on pitch angle. By utilizing the principle of biplane multiple reflections, a bivariate laser spot displacement analysis algorithm is devised to attain highly precise measurements of bivariate angles. Additionally, a temperature gradient comparison algorithm is introduced to calculate the indicator test results under specific temperature conditions. To validate the effectiveness and reliability of this method, a testing system is constructed and utilized. The results demonstrate that the thermal deformation angle change test achieves an impressive accuracy of 0.015″ and a rate of thermal deformation angle change of 0.3247″/°C. These values are in close agreement with the previously simulated analysis result of 0.359″/°C, with only a relative error of 9.55%. Therefore, the test results confirm the efficacy and reliability of this testing method along with the feasibility of the algorithm processing.

Funder

the National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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