Balloon: An Elastic Data Management Strategy for Interlaced Magnetic Recording

Author:

Zhang Chi1ORCID,Liu Song1ORCID,Yu Fangxing1,Li Menghan1,Tang Wei2,Liu Fei2,Wu Weiguo1ORCID

Affiliation:

1. School of Computer Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China

2. ByteDance US Infrastructure System Lab, ByteDance Inc., Mountain View, CA 94041, USA

Abstract

Recently, the emerging technology known as Interlaced Magnetic Recording (IMR) has been receiving widespread attention from both industry and academia. IMR-based disks incorporate interlaced track layouts and energy-assisted techniques to dramatically increase areal densities. The interlaced track layout means that in-place updates to the bottom track require rewriting the adjacent top track to ensure data consistency. However, at high disk utilization, frequent track rewrites degrade disk performance. To address this problem, we propose a solution called Balloon to reduce the frequency of track rewrites. First, an adaptive write interference data placement policy is introduced, which judiciously places data on tracks with low rewrite probability to avoid unnecessary rewrites. Next, an on-demand data shuffling mechanism is designed to reduce user-requests write latency by implicitly migrating data and promptly swapping tracks with high update block coverage to the top track. Finally, a write-interference-free persistent buffer design is proposed. This design dynamically adjusts buffer admission constraints and selectively evicts data blocks to improve the cooperation between data placement and data shuffling. Evaluation results show that Balloon significantly improves the write performance of IMR-based disks at medium and high utilization compared with state-of-the-art studies.

Funder

the National Natural Science Foundation of China

ByteDance Inc.

Key Basic Research Projects of the Foundation Plan of China

Shandong Provincial Natural Science Foundation

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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