Advances in Femtosecond Laser GHz-Burst Drilling of Glasses: Influence of Burst Shape and Duration

Author:

Balage Pierre1,Bonamis Guillaume2ORCID,Lafargue Manon12,Guilberteau Théo1,Delaigue Martin2,Hönninger Clemens2,Qiao Jie13,Lopez John1,Manek-Hönninger Inka1ORCID

Affiliation:

1. Université de Bordeaux-CNRS-CEA, CELIA UMR 5107, 33405 Talence, France

2. AMPLITUDE, Cité de la Photonique, 33600 Pessac, France

3. Chester F. Carlson Center for Imaging Science, Rochester Institute of Technology, Rochester, NY 14623, USA

Abstract

The femtosecond GHz-burst mode laser processing has attracted much attention in the last few years. Very recently, the first percussion drilling results obtained in glasses using this new regime were reported. In this study, we present our latest results on top-down drilling in glasses, focusing specifically on the influence of burst duration and shape on the hole drilling rate and the quality of the drilled holes, wherein holes of very high quality with a smooth and glossy inner surface can be obtained. We show that a decreasing energy repartition of the pulses within the burst can increase the drilling rate, but the holes saturate at lower depths and present lower quality than holes drilled with an increasing or flat energy distribution. Moreover, we give an insight into the phenomena that may occur during drilling as a function of the burst shape.

Funder

CNRS Innovation

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference26 articles.

1. Ablation-cooled material removal with ultrafast bursts of pulses;Kerse;Nature,2016

2. High-power Yb-doped all-fiber laser delivering 300 fs pulses for high-speed ablation-cooled materiel removal;Elahi;Opt. Lett.,2018

3. High efficiency femtosecond laser ablation with gigahetz level burst;Bonamis;J. Laser Appl.,2019

4. Systematic study of laser ablation with GHz bursts of femtosecond pulses;Bonamis;Opt. Expr.,2020

5. Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications;Hirsiger;Proc. SPIE,2020

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