Affiliation:
1. School of Mechanical Engineering, Beijing Institute of Technology, No. 5 Zhongguancun South Street, Haidian District, Beijing 300081, China
2. Beijing Institute of Technology Chongqing Innovation Center, Chongqing 401120, China
Abstract
Microlens arrays have been widely employed to control the reflection, refraction, and diffraction characteristics of light due to its distinctive surface properties. Precision glass molding (PGM) is the primary method for the mass production of microlens arrays, of which pressureless sintered silicon carbide (SSiC) is a typical mold material due to its excellent wear resistance, high thermal conductivity, high-temperature resistance, and low thermal expansion. However, the high hardness of SSiC makes it hard to be machined, especially for optical mold material that requires good surface quality. The lapping efficiency of SSiC molds is quite low. and the underlying mechanism remains insufficiently explored. In this study, an experimental study has been performed on SSiC. A spherical lapping tool and diamond abrasive slurry have been utilized and various parameters have been carried out to achieve fast material removal. The material removal characteristics and damage mechanism have been illustrated in detail. The findings reveal that the material removal mechanism involves a combination of ploughing, shearing, micro-cutting, and micro-fracturing, which aligns well with the results obtained from finite element method (FEM) simulations. This study serves as preliminary reference for the optimization of the precision machining of SSiC PGM molds with high efficiency and good surface quality.
Funder
National Natural Science Foundation of China
Beijing Municipal Natural Science Foundation
Science and Technology Major Project of Jiangxi Province
Natural Science Foundation of Chongqing of China
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering