Affiliation:
1. Faculty of Mechatronics and Mechanical Engineering, Kielce University of Technology, al. Tysiąclecia P.P. 7, 25-314 Kielce, Poland
Abstract
Significant amounts of heat flow can be removed with small temperature differences by boiling. This process is used in a variety of industries, e.g., cooling electronics, digital circuits, power sources, etc. Heat dissipation from equipment that generates significant heat flows involves the movement of thermal energy through a wall into a cooling fluid. In the present study, this mechanism was analysed during the boiling of Novec-649 fluid at atmospheric pressure. The heat transfer surfaces were samples made of copper with milled, parallel grooves with a depth of 0.3 mm and a width ranging from 0.2 to 0.5 mm in 0.1 mm increments for straight channels and channels inclined with respect to the vertical by 30° and 60°, respectively. The study was carried out from the onset of nucleate boiling, approximately q = 7 kWm−2 with a heat flux increase until the critical heat flux was reached. The maximum heat flux was 262 kWm−2 and the heat transfer coefficient was 19.4 kWm−2K−1, achieved for surfaces with straight microchannels. A maximum heat flux increased by 80% and a heat transfer coefficient twice as high compared to a smooth surface was obtained. The performance of the experiment can be deemed adequate, considering that it compares well with the correlation results of different authors.
Subject
Energy (miscellaneous),Energy Engineering and Power Technology,Renewable Energy, Sustainability and the Environment,Electrical and Electronic Engineering,Control and Optimization,Engineering (miscellaneous),Building and Construction
Cited by
3 articles.
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