Facile Fabrication of Highly Perforated Hollow Metallic Cylinder with Changeable Micro-Orifices by Electroforming-Extrusion Molding Hybrid Process

Author:

Zhang Junzhong,Ming Pingmei,Zhang Xinmin,Qin Ge,Yan Liang,Zhao Xiaokang,Zheng Xingshuai

Abstract

A seamless thin-walled hollow metallic cylinder with array of micro-perforations is one of the key components for some products. Normally, these micro-perforations are formed by removing material from the given metallic hollow cylinder (pipe or tube) one by one or row by row. To efficiently and flexibly manufacture such a highly perforated hollow cylinder, this paper proposed a hybrid technique combining extrusion moulding process and electroforming process. In the hybrid technique, the extrusion moulding process was used to create polymer extrusion patterns on the outside surface of the given stainless steel (SS) pipe, and then the electroforming process was carried out using the SS pipe as the mandrel. The formation of the polymer extrusion patterns was simulated and extruding molding experiments were carried out to examine the feasibility of the various mandrels. Electroforming experiments were implemented to verify the achievement of the seamless perforated thin-walled hollow cylinder. It was found that five different types of polymer extrusion pattern were able to be obtained on the same extruding pipe just by adjusting some extruding conditions and parameters, and correspondingly four types of perforated hollow cylinder with different tapered orifices are produced after the electroforming process. The obtainable perforations are: perforation with double conic-orifices, perforation with hemispheric orifice and conic orifice, unidirectionally tapered perforation, and straight-walled perforation. The geometric profile of the extrusion patterns is highly dependent on the processing conditions and parameters. The proposed hybrid process represents a promising alternative process to fabricate seamless thin-walled perforated hollow metallic cylinder efficiently, flexibly, and with low cost.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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