Combined fabrication of terahertz hollow-core metal rectangular waveguide cavity using electrochemical deposition and selective chemical dissolution
Author:
Affiliation:
1. Henan Institute of Technology, Xinxiang 453003, China
2. State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, China
3. Northwestern Polytechnical University, Xian 710072, China
Funder
Scientific and Technological Research Projects in Henan Province
Open Research Fund of State Key Laboratory of High Performance Complex Manufacturing, Central South University
National Natural Science Foundation of China
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0083639
Reference20 articles.
1. Development and future prospects of terahertz technology
2. At the Dawn of a New Era in Terahertz Technology
3. Emerging non-destructive terahertz spectroscopic imaging technique: Principle and applications in the agri-food industry
4. Investigation on 3-D-Printing Technologies for Millimeter- Wave and Terahertz Applications
5. Low-Frequency Noise and Passive Imaging With 670 GHz HEMT Low-Noise Amplifiers
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A 0.9-THz Integrally Manufactured High-Precision Waveguide Cavity Filter Using Electrochemical Micromachining Technology;IEEE Transactions on Microwave Theory and Techniques;2023-10
2. Research on Integral Fabrication and Inner Surface Metallization of the High-Frequency Terahertz Hollow-Core Metal Rectangular Waveguide Cavity by a Combined Process Based on Wire Electrochemical Micromachining and Electrochemical Deposition;Micromachines;2022-08-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3