Affiliation:
1. School of Petrochemical Engineering, Shenyang University of Technology, Liaoyang 111003, China
2. School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China
3. Guangdong Provincial Laboratory of Chemistry and Fine Chemical Engineering Jieyang Center, Jieyang 522000, China
4. Aromatics Laboratory, Liaoyang Petrochemical Company, Liaoyang 111003, China
Abstract
The design of high-performance polyimide (PI) films and understanding the relationship of the structure–dielectric property are of great significance in the field of the microelectronics industry, but are challenging. Herein, we describe the first work to construct a series of novel tert-butyl PI films (denoted as PI-1, PI-2, PI-3, and PI-4) based on a low-temperature polymerization strategy, which employed tetracarboxylic dianhydride (pyromellitic anhydride, 3,3′,4,4′-biphenyl tetracarboxylic anhydride, 4,4′-diphenyl ether dianhydride, and 3,3′,4,4′-benzophenone tetracarboxylic anhydride) and 4,4′-diamino-3,5-ditert butyl biphenyl ether as monomers. The results indicate that introducing tert-butyl branches in the main chain of PIs can enhance the free volume of the molecular chain and reduce the interaction between molecular chains of PI, resulting in a low dielectric constant. Particularly, the optimized PI-4 exhibits an excellent comprehensive performance with a high (5) wt% loss temperature (454 °C), tensile strength (117.40 MPa), and maximum hydrophobic angle (80.16°), and a low dielectric constant (2.90), which outperforms most of the results reported to date.
Funder
National Natural Key R&D Program of China
National Natural Science Foundation of China
National Natural Science and Technology Major Project
Liaoning Province Science and Technology Plan Joint Plan (Fund) Project
Reference52 articles.
1. Research Progress in Anisotropic Thermal Conduction Behavior of Polyimide Films;Gao;Acta Polym. Sin.,2021
2. Progress in low dielectric polyimide film—A review;Li;Prog. Org. Coat.,2022
3. Wang, X., Liu, S.Y., Han, H.Y., Liu, X.Y., and Wang, X. (2023). Research progress in insulating and thermal conductivity of fluorinated graphene and its polyimide composites. IET Nanodielectr.
4. Research progress of high thermal conductivity polyimide dielectric films;Zha;Acta Phys. Sin.,2022
5. Research progress of filled-type high-thermal-conductivity flexible polyimide composites: A review;Zhou;J. Mater. Sci.,2023