Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures-Reference-Cited by-同舟云学术

Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures

Published:2023-08-25 Issue:17 Volume:16 Page:5822
ISSN:1996-1944
Container-title:Materials
language:en
Short-container-title:Materials

Author:

Yang Shih-Chi¹,Tran Dinh-Phuc¹^ORCID,Chen Chih¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan

Abstract

The behavior of recrystallization and grain growth was examined in Cu-Cu joints during electromigration at 150 °C. Recrystallization and grain growth were observed in all the joints after electromigration for 9000 h. Voiding was formed in Cu current-feeding lines and in bonding interfaces, and resistance increased with time due to the void formation. However, instead of rising abruptly, the resistance of certain Cu joints dropped after 7000 h. Microstructural analysis revealed that a large grain growth occurred in these joints at 150 °C, and the bonding interface was eliminated. Therefore, the electromigration lifetime can be prolonged for these joints.

Funder

National Science and Technology Council, Taiwan

Publisher

MDPI AG

Subject

General Materials Science

Link

https://www.mdpi.com/1996-1944/16/17/5822/pdf

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