Fiber-to-Chip Three-Dimensional Silicon-on-Insulator Edge Couplers with High Efficiency and Tolerance

Author:

Li Xiaoyu1,Yu Shengtao2,Gui Chengqun1

Affiliation:

1. The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China

2. School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China

Abstract

The edge coupler is an indispensable optical device for connecting an external fiber and on-chip waveguide. The coupling efficiency of the edge coupler affects the effective integration of optical circuits. In this study, three-dimensional (3D) edge couplers with high efficiency and tolerance are proposed. The high coupling efficiency of the 3D edge couplers is verified by theoretical calculations. Three couplers are fabricated on a thick-silicon platform via 3D grayscale lithography. At the 1550 nm band, the fiber-to-chip experimental data show that the maximum coupling efficiencies of the three edge couplers are 0.70 dB and 1.34 dB, 0.80 dB and 1.60 dB, and 1.00 dB and 1.14 dB for the TE and TM modes, respectively. At the 1550 nm band, misalignment tolerances measurement data reveal 0.8 dB/0.9 dB tolerance of ±5 μm in the horizontal direction, and 1.7 dB/1.0 dB tolerance of ±2 μm in the vertical direction for TE/TM mode. This study provides a new idea for the design of 3D edge couplers and demonstrates significant superiority in research and industrial applications.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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