Innovative Bistable Composites for Aerospace and High-Stress Applications: Integrating Soft and Hard Materials in Experimental, Modeling, and Simulation Studies

Author:

Zouhri Khalid1,Mohamed Mohamed2,Erol Anil3,Liu Bert45,Appiah-Kubi Philip1

Affiliation:

1. Department of Engineering Management, Systems & Technology, University of Dayton, 300 College Park, Kettering Lab 241M, Dayton, OH 45469, USA

2. Department of Mechanical Engineering, University of Dayton, 300 College Park, Kettering Lab 241M, Dayton, OH 45469, USA

3. Northrop Grumman, 2980 Fairview Park Drive, Falls Church, VA 22042, USA

4. Structural Materials Division, University of Dayton Research Institute, 1700 South Patterson Blvd, Dayton, OH 45469, USA

5. Air Force Research Laboratory, Aerospace Systems Directorate, 1790 Loop Road N., Bldg. 490, Wright-Patterson AFB, Dayton, OH 45433, USA

Abstract

This study explores the development and performance of bistable materials, emphasizing their potential applications in aero-vehicles and high-stress environments. By integrating soft and hard materials within a composite structure, the research demonstrates the creation of bistable composites that exhibit remarkable flexibility and rigidity. Advanced simulations using COMSOL Multiphysics and 3D-printed prototypes reveal that these materials effectively absorb and dissipate stress, maintaining structural integrity under high-pressure conditions. Compression tests highlight the ability of bistable structures to bear significant loads, distributing stress efficiently across multiple layers. The innovative proposal of combining stiff and flexible materials within a single unit cell enhances bistable behavior, offering superior energy absorption and resilience. This work underscores the promise of bistable materials in advancing materials science, providing robust solutions for aerospace, automotive, and protective gear applications and paving the way for future research in optimizing bistable structures for diverse engineering challenges.

Funder

University of Dayton and the University of Dayton Research Institute Summer Fellowship Program

Publisher

MDPI AG

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