N+-Implantation on Nb Coating as Protective Layer for Metal Bipolar Plate in PEMFCs and Their Electrochemical Characteristics

Author:

Kim Yu-Sung1,Choi Jin-Young1,Kim Cheong-Ha1,Lee In-Sik1,Jun Shinhee2,Kim Daeil3,Cha Byung-Chul1,Kim Dae-Wook1

Affiliation:

1. Advanced Manufacturing Process R & D Group, Ulsan Regional Division, Korea Institute of Industrial Technology (KITECH), 55, Jongga-ro, Jung-gu, Ulsan 44313, Republic of Korea

2. DAE-IL Co., 8, Bonggyenonggong-gil, Ulju-gun, Ulsan 44914, Republic of Korea

3. School of Materials Science & Engineering, University of Ulsan, 55-12, Techno Saneop-ro, Nam-gu, Ulsan 44776, Republic of Korea

Abstract

Nitrogen ions were implanted into the coated Nb layer by plasma immersion ion implantation to improve resistance to corrosion of a metal bipolar plate. Due to nitrogen implantation, the corrosion behavior of the Nb layer was enhanced. The electron microscope observation reveals that the microstructure of the Nb layer became denser and had fewer defects with increasing implantation energy. As a result, the densified structure effectively prevented direct contact with the corrosive electrolyte. In addition, at a higher implantation rate (6.40 × 1017 N2/cm2), a thin amorphous layer was formed on the surface, and the implanted nitrogen ions reacted at neighboring Nb sites, resulting in the localized formation of nitrides. Such phase and structural changes contributed to further improve corrosion resistance. In particular, the implanted Nb layer at bias voltage of 10 kV exhibited a current density more than one order of magnitude smaller with a two times faster stabilization than the as-deposited Nb layer under the PEMFC operating conditions.

Funder

KITECH

the Ministry of Science and ICT through the National Research Foundation of Korea

Publisher

MDPI AG

Subject

General Materials Science

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