Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper
Author:
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/8/4/274/pdf
Reference23 articles.
1. Ultrasonic-assisted brazing of Al–Ti dissimilar alloy by a filler metal with a large semi-solid temperature range
2. Ultrasonic welding between mild steel sheet and Al–Mg alloy sheet
3. Si particulate-reinforced ZnAl based composites joints of hypereutectic Al50Si alloys by ultrasonic-assisted soldering
4. Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn Alloy
5. Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air
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1. Joining of SiO2 glass and substrate using In49Sn active solder in air;Journal of Materials Science: Materials in Electronics;2024-01
2. Ultrasonic-induced metallurgical bonding between W90 tungsten heavy alloy and AZ31B Mg alloy using Sn;Materials Letters;2023-12
3. Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite;Materials;2023-05-17
4. Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder;Materials;2023-04-10
5. Effect of the B 4 C particles on the brazed joints of SiC ceramics and 2219 aluminum alloy;International Journal of Ceramic Engineering & Science;2022-11-22
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