Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air-Reference-Cited by-同舟云学术

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Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air

Published:2016-03 Issue: Volume:166 Page:219-222
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Lai Zhiwei,Chen Xiaoguang,Pan Chuan,Xie Ruishan,Liu Lei,Zou Guisheng

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Natural Science Foundation of Beijing

Specialized Research Fund

Tsinghua University Initiative Scientific Research Program

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Transient liquid phase bonding of magnesium alloy (Mg–3Al–1Zn) using aluminium interlayer

2. Diffusion bonding of AZ91 using a silver interlayer

3. Effect of bonding time on microstructure and mechanical properties of transient liquid phase bonded magnesium AZ31 alloy

4. Transient liquid phase bonding of magnesium alloy (Mg – 3Al – 1Zn) using copper interlayer

5. Ultrasonic spot welding of Al/Mg/Al tri-layered clad sheets

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1. Joined AZ31B Magnesium Alloys with Ag Interlayer by Ultrasonic-Induced Transient Liquid Phase Bonding in Air;Acta Metallurgica Sinica (English Letters);2024-04-22

2. Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging;Materials Characterization;2024-04

3. A novel diffusion bonding of 6063Al based on a mode of diffusion-migrating and suspension-broken of surface oxide film;Journal of Materials Research and Technology;2023-11

4. Microstructure and Properties of Magnesium Alloy Joints Bonded by Using Gallium with the Assistance of Ultrasound at Room Temperature;Materials;2023-10-31

5. Sonocapillary and wetting mechanism during ultrasonic brazing porous Si3N4 ceramics in air;Surfaces and Interfaces;2023-10

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