Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding-Reference-Cited by-同舟云学术

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Published:2016-10-18 Issue:10 Volume:7 Page:192
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Bleiker Simon,Visser Taklo Maaike,Lietaer Nicolas,Vogl Andreas,Bakke Thor,Niklaus Frank

Funder

European Research Council

Vetenskapsrådet

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

http://www.mdpi.com/2072-666X/7/10/192/pdf

Reference28 articles.

1. Adhesive wafer bonding for MEMS applications;Dragoi;Proc. SPIE,2003

2. Integrating MEMS and ICs

3. Vacuum packaging for microsensors by glass-silicon anodic bonding

4. Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging

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1. A size-dependent imperfect interface model for adhesively bonded joints considering strain gradient elasticity;International Journal of Solids and Structures;2024-04

2. Cavity-Depth Effect on 3D Wafer-Level-Packaged MEMS Resonators by Slide-Film Damping;Sensors and Materials;2024-02-06

3. Tutorial: Piezoelectric and magnetoelectric N/MEMS—Materials, devices, and applications;Journal of Applied Physics;2022-06-28

4. Wafer-Level Assembly of Physics Package for Chip-Scale Atomic Clocks;IEEE Sensors Journal;2022-04-01

5. A size-dependent model for predicting the mechanical behaviors of adhesively bonded layered structures based on strain gradient elasticity;International Journal of Mechanical Sciences;2021-05

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