Creep Behavior of a Sn-Ag-Bi Pb-Free Solder
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/5/11/2151/pdf
Reference22 articles.
1. A Viscoplastic Theory for Braze Alloys;Neilsen,1996
2. Development of the damage state variable for a unified creep plasticity damage constitutive model of the 95.5Sn-3.9Ag-0.6Cu for lead-free solder;Pierce;J. Electron. Pack.,2008
3. Lead-Free Solder Interconnect Reliability;Shangguan,2005
4. Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis
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1. Effect of IMC Thickness on the Mechanical Properties of Microbumps;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02
2. Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder;Journal of Electronic Materials;2023-01-07
3. Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys;Journal of Electronic Materials;2019-10-03
4. Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties;Journal of Electronic Materials;2019-07-29
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