Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties-Reference-Cited by-同舟云学术

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Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Published:2019-07-29 Issue:1 Volume:49 Page:152-172
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Vianco Paul T.,McKenzie Bonnie B.,Rejent Jerome A.,Grazier J. Mark,Jaramillo Celedonio E.,Kilgo Alice C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07456-4.pdf

Reference60 articles.

1. P. Snugovsky, S. Bagheri, M. Romansky, D. Perovic, L. Snugovsky, and J. Rutter, J. Surf. Mount Technol. 25, 42 (2012).

2. P. Vianco and J. Rejent, US Patent 5,439,639 (1995).

3. P. Vianco and J. Rejent, J. Electron. Mater. 28, 1131 (1999).

4. P. Vianco and J. Rejent, J. Electron. Mater. 28, 1139 (1999).

5. P. Vianco, I. Artaki, and A. Jackson, in Proceedings of Surface Mount International Conference (1994), pp. 437–448.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of IMC Thickness on the Mechanical Properties of Microbumps;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

2. Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder;Journal of Electronic Materials;2023-01-07

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