Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper

Author:

Wu Xian1ORCID,Zhang Kechuang1,Sun Ke1,Jiang Feng2ORCID,Shen Jianyun1,Li Hongyou1,Gu Lizhi3

Affiliation:

1. College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China

2. Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021, China

3. Fujian University Key Laboratory of Virtual Manufacturing Technology, Quanzhou University of Information Engineering, Quanzhou 362000, China

Abstract

Energy-field-assisted cutting exhibits excellent ability to reduce cutting force and improve machining quality. In this study, a magnetic field was applied in an innovative way to aid in the cutting process, and magnetic-field-assisted scratching experiments of single-crystal copper were carried out. It was found that magnetic-field-assisted scratching increased the actual scratching force due to the additional Lorentz force in the cutting process. However, the friction coefficient of the magnetic-field-assisted scratching was reduced by 19.4% due to the tribological modification effect on tool/chip contact. Meanwhile, magnetic-field-assisted scratching was conducive to decreasing the degree of chip deformation, reducing microburrs on the machined surface, and obtaining a surface roughness reduction of an average of 26.8%. The possible reason for this effect was that the presence of a magnetic field in the cutting process promoted the dislocation slip of metal materials. The results indicated that magnetic-field-assisted cutting improves the machinability in the metal cutting process.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference32 articles.

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