Analysing the Contact Conduction Influence on the Heat Transfer Intensity in the Rectangular Steel Bars Bundle

Author:

Kolmasiak Cezary,Bagdasaryan VazgenORCID,Wyleciał TomaszORCID,Gała MarekORCID

Abstract

Bundles of steel bars, besides metal foams, are an example of cellular solids. Such bundles constitute a charge during the heat treatment of bars. The paper presents a mathematical model of transient heat transfer in a bundle of rectangular steel bars based on the energy balance method. The key element of this model is the procedure of determining the effective thermal conductivity using the electrical analogy. Different mechanisms of heat transfer occurring within the analysed medium (conduction in steel and contact conduction) are assigned corresponding thermal resistances. The discussed procedure involves expressing these resistances with the use of arithmetic relationships describing their changes in the temperature function. Thermal contact resistance has been described with the use of the relationships determined experimentally. As a result of the performed calculations, the influence of contact conduction between the adjacent bars and bundle arrangement on its heating time was established. The results of the calculations show that the heating time of bundles can be lowered by 5–40% as a result of a decrease in the thermal contact resistance. This effect depends on the bar size and bundle arrangement. From the practical point of view, the analysed problem is connected with the optimization of the heat treatment processes of steel bars.

Publisher

MDPI AG

Subject

General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3