Cellular and Molecular Events of Wound Healing and the Potential of Silver Based Nanoformulations as Wound Healing Agents

Author:

Tyavambiza CarolineORCID,Meyer MervinORCID,Meyer SamanthaORCID

Abstract

Chronic wounds are a silent epidemic threatening the lives of many people worldwide. They are associated with social, health care and economic burdens and can lead to death if left untreated. The treatment of chronic wounds is very challenging as it may not be fully effective and may be associated with various adverse effects. New wound healing agents that are potentially more effective are being discovered continuously to combat these chronic wounds. These agents include silver nanoformulations which can contain nanoparticles or nanocomposites. To be effective, the discovered agents need to have good wound healing properties which will enhance their effectiveness in the different stages of wound healing. This review will focus on the process of wound healing and describe the properties of silver nanoformulations that contribute to wound healing.

Funder

South African National Research Foundation

DSI/MINTEK Nanotechnology Innovation Centre

Publisher

MDPI AG

Subject

Bioengineering

Reference136 articles.

1. Skin Tissue Engineering: Wound Healing Based on Stem-Cell-Based Therapeutic Strategies;Stem Cell Res. Ther.,2019

2. Basic Science of Wound Healing;Surgery,2008

3. Silver Nanoparticles: The Powerful Nanoweapon against Multidrug-Resistant Bacteria;J. Appl. Microbiol.,2012

4. Certain Aspects of Silver and Silver Nanoparticles in Wound Care: A Minirev;EBSCOhost,2016

5. The Silver Lining: Towards the Responsible and Limited Usage of Silver;J. Appl. Microbiol.,2017

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