A Simplified Dynamic Strength Analysis of Cardboard Packaging Subjected to Transport Loads

Author:

Mrówczyński Damian1ORCID,Gajewski Tomasz2ORCID,Garbowski Tomasz3ORCID

Affiliation:

1. Doctoral School, Poznan University of Life Sciences, Wojska Polskiego 28, 60-637 Poznan, Poland

2. Institute of Structural Analysis, Poznan University of Technology, Piotrowo 5, 60-965 Poznan, Poland

3. Department of Biosystems Engineering, Poznan University of Life Sciences, Wojska Polskiego 50, 60-627 Poznan, Poland

Abstract

The article presents a simplified method for determining the strength of corrugated board packaging subjected to dynamic transport loads. The proposed algorithm consists of several calculation steps: (1) a static analysis of the compressive strength of the package, (2) an analysis of random vibrations in the frequency domain used to determine the resonance frequencies and (3) a dynamic analysis of the package loaded with computed resonant frequencies. For this purpose, numerical models of the static compression test of the packaging before and after the dynamic analysis of the package subjected to general transport loads were developed. In order to validate the model, laboratory packaging compression tests were also performed for samples of boxes using three-layer cardboard. Due to this, it was possible to verify the numerical simulation results of the compression tests for several box geometries. This, in turn, allowed for the development of a method based on dynamic and post-dynamic (static) numerical analyses, permitting a high-accuracy determination of the resistance of the selected packaging to vibrations and dynamic loads. The results of the (experimentally validated) numerical analysis proved the usefulness of the simplified method presented herein for precise estimation of the load capacity of various packages dynamically loaded during transport.

Funder

Ministry of Education and Science, Poland, from Poznan University of Technology for Young Researchers

Publisher

MDPI AG

Subject

General Materials Science

Reference33 articles.

1. Motylewski, M., Kurznik, J., Szwarc, M., Kolegov, P., Luzan, S., Rossier, S., and Bartnik, K. (2018). From Fibre to Corrugated Board Correlations between Paper and Corrugated Board, Mondi Group, Margrafsen Publishing House.

2. Mrówczyński, D., Knitter-Piątkowska, A., and Garbowski, T. (2022). Non-local sensitivity analysis and numerical homogenization in optimal design of single-wall corrugated board packaging. Materials, 15.

3. Mrówczyński, D., Gajewski, T., and Garbowski, T. (2023). Sensitivity Analysis of Open-Top Cartons in Terms of Compressive Strength Capacity. Materials, 16.

4. Garbowski, T., Mrówczyński, D., and Grabski, J.K. (2023). Modified Compression Test of Corrugated Board Fruit Tray: Numerical Modeling and Global Sensitivity Analysis. Materials, 16.

5. (2016). Packaging—Complete, Filled Transport Packages and Unit Loads—Vertical Random Vibration Test (Standard No. ISO 13355:2016).

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3