Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications
Author:
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
Link
http://www.mdpi.com/1424-8220/17/9/2080/pdf
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1. High-Temperature High-Bandwidth Fiber Optic MEMS Pressure-Sensor Technology for Turbine Engine Component Testing;Pulliam;Proc. SPIE Int. Soc. Opt. Eng.,2002
2. A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit
3. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures
4. High Reliability of MEMS Packaged Capacitive Pressure Sensor Employing 3C-SiC for High Temperature
5. High Temperature Piezoresistive β-SiC-on-SOI Pressure Sensor for Combustion Engines
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