Adhesion Stability According to Adhesion Area of Traditional Tile Gluing Method

Author:

Kim Jae-Gyu1,Kim Bum-Soo2,Jiang Bo3,Kim Byoungil4ORCID

Affiliation:

1. Department of Smart City Engineering, Seoul National University of Science & Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea

2. BK Waterproof Technology Research Institute, 232 Gongneung-ro, Nowon-gul, Seoul 01811, Republic of Korea

3. School of Civil Engineering Architecture and Environment, Hubei University of Technology, No. 28, Nanli Road, Hong-Shan District, Wuchang, Wuhan 430068, China

4. School of Architecture, Seoul National University of Science & Technology, Seoul 01811, Republic of Korea

Abstract

In this study, verification was conducted through experiments to identify problems caused by traditional attachment methods in order to highlight the need for a suitable attachment method for new tile types according to changes in materials, production technology, and demand. The stability of adhesion strength was evaluated by subdividing the size of the adhesion area and adhesion strength measurement method for the country-type attachment method. The adhesion area on the back of the tile was divided into 60% and 80%, and the test specimens used in the experiment were tested for partial adhesion strength (Ta-1), overall adhesion strength (Ta-2), and adhesion strength after splitting (Ta-3), and the results were derived. As a result of conducting the adhesion test presented in the current national building standard tile specification (KCS 41 48 01) for 80% of the backfill area, the average adhesive strength was 0.85 N/mm2, and the standard strength was 0.39 N/mm2. However, as a result of the arithmetic average test of the adhesive strength of all tiles or cutting of the entire tile, rather than the partial adhesion test method of the mortar-attached part, it was confirmed that the adhesive strength was about −20% less than the current KCS 0.39 N/mm2.

Funder

Seoul National University of Science & Technology

Publisher

MDPI AG

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