Electroplated Functional Materials with 3D Nanostructures Defined by Advanced Optical Lithography and Their Emerging Applications

Author:

Ahn Jinseong,Hong Seokkyoon,Shim Young-Seok,Park JunyongORCID

Abstract

Electroplating has been favored to date as a surface treatment technology in various industries in the development of semiconductors, automobiles, ships, and steel due to its advantages of being a simple, solution-based process, with low cost and high throughput. Recently, classical electroplating has been reborn as an advanced manufacturing process for functional materials by combining it with unconventional optical three-dimensional (3D) nanofabrication techniques capable of generating polymer templates with high-resolution 3D periodic nanostructures. The bottom-up filling behavior of electroplating rising from a seed layer makes it possible to densely fill the nanoporous network of the template with heterogeneous inorganic materials. At this time, understanding and optimizing the process parameters (e.g., additive, current density, type of current waveform, etc.) of electroplating is critical for defect control. In addition, since electroplating is generally performed near room temperature, unlike other thin film deposition techniques, structural damage to the polymer template by heat during electroplating is almost negligible. Based on the excellent compatibility of electroplating and optical 3D nanofabrication, innovative functional materials with 3D periodic nanostructures targeting electrochemical or energy-related applications have been created. In this mini review, a strategy for producing functional materials with 3D periodic nanostructures through a templating process will be covered, and the recent cases of successful applications to electrodes for energy storage devices, electrocatalysts, and thermoelectric materials will be summarized. We will also discuss technical issues that need to be considered in the process to improve the quality of the resulting functional materials with 3D nanoarchitectures.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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