A High-Reliability RF MEMS Metal-Contact Switch Based on Al-Sc Alloy

Author:

Hou Zhongxuan12ORCID,Zhang Yongkang1,Si Chaowei1ORCID,Han Guowei1,Zhao Yongmei1234,Lu Xiaorui1,Liu Jiahui1,Ning Jin1234,Wei Tongbo5

Affiliation:

1. Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

2. School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

3. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

4. State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Beijing 100083, China

5. Research and Development Center for Semiconductor Lighting Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

Abstract

This paper presents a new metal-contact RF MEMS switch based on an Al-Sc alloy. The use of an Al-Sc alloy is intended to replace the traditional Au-Au contact, which can greatly improve the hardness of the contact, and thus improve the reliability of the switch. The multi-layer stack structure is adopted to achieve the low switch line resistance and hard contact surface. The polyimide sacrificial layer process is developed and optimized, and the RF switches are fabricated and tested for pull-in voltage, S-parameters, and switching time. The switch shows high isolation of more than 24 dB and a low insertion loss of less than 0.9 dB in the frequency range of 0.1–6 GHz.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference24 articles.

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3. RF MEMS from a device perspective;Yao;J. Micromech. Microeng.,2000

4. Distributed MEMS tunable matching network using minimal-contact RF-MEMS varactors;Shen;IEEE Trans. Microw. Theory Tech.,2006

5. A 2-bit miniature X-band MEMS phase shifter;Tan;IEEE Microw. Wirel. Compon. Lett.,2003

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