Quantification of the Effective Detectable Period for Concrete Voids of CLP by Lock-In Thermography

Author:

Kim Chunyoung1,Kang Seongmin1,Chung Yoonjae2,Kim Okhwan3,Kim Wontae2ORCID

Affiliation:

1. enesG, 8, Techno 10-ro, Yuseong-gu, Daejeon 34026, Republic of Korea

2. Eco-Sustainable Energy Research Institute, Kongju National University, 1223-24 Cheonan-daero, Seobuk-gu, Cheonan-si 31080, Republic of Korea

3. Division of Mechanical & Automotive Engineering, Kongju National University, 1223-24 Cheonan-daero, Seobuk-gu, Cheonan-si 31080, Republic of Korea

Abstract

This study is to inspect the voids between the concrete containment building and the containment liner plate (CLP) in the light-water reactor type nuclear power plant with lock-in thermography (LIT) inspection technology. For that, a finite element method (FEM) model containing concrete voids was created, and the thermal distribution change of the CLP surface was simulated through numerical analysis simulation of various LIT inspection conditions and converted with real-time thermography data. For the simulated temperature distribution image and the amplitude and phase images calculated by the four-point method, the signal-to-noise ratio (SNR) is analyzed based on the sound area and void areas. As a result, the difference in SNR according to the size of voids was remarkable, and the effective detectable period (EDP), which was common to each inspection condition, was derived. Furthermore, a CLP concrete mockup identical to the model shape is produced, and the thermal image of the EDP is analyzed through the experiment with the same analysis technique, and the results are compared. Although there are some differences between the numerical analysis conditions and the experimental environments, the deduction and utilization of EDP through FEM simulation are considered useful approaches to applying LIT to inspect concrete voids on the back of the CLP.

Funder

Korea Ministry of SMEs and Startups in 2023

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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