Effect of Through-the-Thickness Delamination Position on the R-Curve Behavior of Plain-Woven ENF Specimens

Author:

Salamat-Talab Mazaher1,Akhavan-Safar Alireza2ORCID,Zeinolabedin-Beygi Ali1ORCID,Carbas Ricardo J. C.2ORCID,da Silva Lucas F. M.3ORCID

Affiliation:

1. Department of Mechanical Engineering, Arak University of Technology, Arak 38181-41167, Iran

2. Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias 400, 4200-465 Porto, Portugal

3. Departamento de Engenharia Mecânica, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

Abstract

In this study, the effect of through-the-thickness delamination plane position on the R-curve behavior of end-notch-flexure (ENF) specimens was investigated using experimental and numerical procedures. From the experimental point of view, plain-woven E-glass/epoxy ENF specimens with two different delamination planes, i.e., [012//012] and [017//07], were manufactured by hand lay-up method. Afterward, fracture tests were conducted on the specimens by aiding ASTM standards. The main three parameters of R-curves, including the initiation and propagation of mode II interlaminar fracture toughness and the fracture process zone length, were analyzed. The experimental results revealed that changing the delamination position in ENF specimen has a negligible effect on the initiation and steady steady-state toughness values of delamination. In the numerical part, the virtual crack closure technique (VCCT) was used in order to analyze the imitation delamination toughness as well as the contribution of another mode on the obtained delamination toughness. The numerical results indicated that by choosing an appropriate value of cohesive parameters, the trilinear cohesive zone model (CZM) is capable of predicting the initiation as well as propagation of the ENF specimens. Finally, the damage mechanisms at the delaminated interface were investigated with microscopic images taken using a scanning electron microscope.

Publisher

MDPI AG

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3