Geometric Shape Induced Small Change of Seebeck Coefficient in Bulky Metallic Wires
Author:
Funder
NSF of China
MOST of China
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
Link
http://www.mdpi.com/1424-8220/17/2/331/pdf
Reference51 articles.
1. International Technology Roadmap for Semiconductors,2013
2. Interconnects for nanoscale MOSFET technology: a review
3. Electrochemical sensing in paper-based microfluidic devices
4. Review of polymer MEMS micromachining
5. Nanoelectromechanical contact switches
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