Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation

Author:

Jankowski MariuszORCID,Zając PiotrORCID,Amrozik PiotrORCID,Szermer MichałORCID,Maj CezaryORCID,Jabłoński GrzegorzORCID,Nazdrowicz Jacek

Abstract

In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the temperature sensitivity of the sensor’s output is nonlinear and particularly strong in the negative Celsius temperature range. It was found that the temperature drift is mainly caused by the MEMS sensor and the influence of the readout circuit is minimal. Moreover, the measurements showed that this temperature dependence is the same regardless of applied acceleration. Simulation of the accelerometer’s model allowed us to estimate the contribution of post-manufacturing mismatch on the thermal drift; for our sensor, the mismatch-induced drift accounted for about 6% of total thermal drift. It is argued that the remaining 94% of the drift could be a result of the presence of residual stress in the structure after fabrication.

Funder

The National Centre for Research and Development in Poland

Publisher

MDPI AG

Subject

Energy (miscellaneous),Energy Engineering and Power Technology,Renewable Energy, Sustainability and the Environment,Electrical and Electronic Engineering,Control and Optimization,Engineering (miscellaneous)

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An Experimental Investigation of Noise Sources’ Contribution in the Multi-Chip Module Open-Loop Comb-Drive Capacitive MEMS Accelerometer;Electronics;2024-07-02

2. Statistical Analysis of the Functioning of the Inertial Acceleration Sensor in a Variable Temperature Environment;2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES);2024-06-27

3. Influence of temperature on the quality of operation of an analog reading system for MEMS structures;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

4. Improvement and compensation of temperature drift of scale factor of a SOI-based MEMS differential capacitive accelerometer;Measurement Science and Technology;2023-05-05

5. Performance Analysis of the Analog Path of Read-Out Integrated Circuit for MEMS structures under Temperature Variation;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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