3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach-Reference-Cited by-同舟云学术

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3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach

Published:2017-10-13 Issue:10 Volume:17 Page:2331
ISSN:1424-8220
Container-title:Sensors
language:en
Short-container-title:Sensors

Author:

Bae Ji,Lee Kye-Sung,Hur Hwan,Nam Ki-Hwan,Hong Suk-Ju,Lee Ah-Yeong,Chang Ki,Kim Geon-Hee,Kim Ghiseok

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

http://www.mdpi.com/1424-8220/17/10/2331/pdf

Reference24 articles.

1. Demystifying 3D ICs: The Pros and Cons of Going Vertical

2. Localization of weak heat sources in electronic devices using highly sensitive lock-in thermography

3. Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis

4. Thermal mapping with liquid crystal method

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