Monolithic Multi Degree of Freedom (MDoF) Capacitive MEMS Accelerometers

Author:

Mohammed Zakriya,Elfadel Ibrahim,Rasras MahmoudORCID

Abstract

With the continuous advancements in microelectromechanical systems (MEMS) fabrication technology, inertial sensors like accelerometers and gyroscopes can be designed and manufactured with smaller footprint and lower power consumption. In the literature, there are several reported accelerometer designs based on MEMS technology and utilizing various transductions like capacitive, piezoelectric, optical, thermal, among several others. In particular, capacitive accelerometers are the most popular and highly researched due to several advantages like high sensitivity, low noise, low temperature sensitivity, linearity, and small footprint. Accelerometers can be designed to sense acceleration in all the three directions (X, Y, and Z-axis). Single-axis accelerometers are the most common and are often integrated orthogonally and combined as multiple-degree-of-freedom (MDoF) packages for sensing acceleration in the three directions. This type of MDoF increases the overall device footprint and cost. It also causes calibration errors and may require expensive compensations. Another type of MDoF accelerometers is based on monolithic integration and is proving to be effective in solving the footprint and calibration problems. There are mainly two classes of such monolithic MDoF accelerometers, depending on the number of proof masses used. The first class uses multiple proof masses with the main advantage being zero calibration issues. The second class uses a single proof mass, which results in compact device with a reduced noise floor. The latter class, however, suffers from high cross-axis sensitivity. It also requires very innovative layout designs, owing to the complicated mechanical structures and electrical contact placement. The performance complications due to nonlinearity, post fabrication process, and readout electronics affects both classes of accelerometers. In order to effectively compare them, we have used metrics such as sensitivity per unit area and noise-area product. This paper is devoted to an in-depth review of monolithic multi-axis capacitive MEMS accelerometers, including a detailed analysis of recent advancements aimed at solving their problems such as size, noise floor, cross-axis sensitivity, and process aware modeling.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference62 articles.

1. Volant Technologies Web Site―Accelerometer and Pressure Sensor MEMS Historyhttp://terahz.org/_html/22SensorChronology.html

2. Sensing Tilt With MEMS Accelerometers

3. Upper Limb Portable Motion Analysis System Based on Inertial Technology for Neurorehabilitation Purposes

4. CMOS MEMS Fabrication Technologies and Devices

Cited by 51 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Nano-g MOEMS Accelerometer Featuring Electromagnetic Force Balance With 157-dB Dynamic Range;IEEE Transactions on Industrial Electronics;2024-06

2. A Review on MEMS Silicon Resonant Accelerometers;Journal of Microelectromechanical Systems;2024-04

3. IoT and AI Based Android App for Safety Assistance and Recommendation;2024 5th International Conference on Intelligent Communication Technologies and Virtual Mobile Networks (ICICV);2024-03-11

4. Self-sustained and self-wakeup wireless vibration sensors by electromagnetic-piezoelectric-triboelectric hybrid energy harvesting;Applied Energy;2024-02

5. Design and simulation of a novel MEMS-based single proof mass three-axis piezo-capacitive accelerometer;Microsystem Technologies;2024-01-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3