Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation

Abstract

A theoretical simulation study of the dispersion characteristic of the surface acoustic wave (Rayleigh wave) was conducted by modeling the adhesion interlayer with stiffness coefficients to evaluate the bonding properties of nano-scale thin film structures. For experimental validation, a set of thin film specimens were fabricated—637 nm, 628 nm, 637 nm, 600 nm, and 600 nm thick titanium (Ti) films were deposited on silicon (Si) (100) substrate using a DC Magnetron sputtering process with DC power from 28.8 W, 57.6 W, 86.4 W, 115.2 W, and 144 W. The thicknesses of the Ti films were measured using a scanning electron microscope (SEM). Surface acoustic wave velocity for each of the manufactured thin film specimens was measured by using a V(z) curve technique of a Scanning Acoustic Microscope. The measured velocity, transducer frequency, and thickness of the film were applied to dispersion characteristic simulation for a given stiffness coefficient to calculate adhesion strength of each specimen. To verify the simulation result, the adhesion force of each specimen was measured using a nano-scratch test and then compared with the calculated values from the dispersion characteristic simulation. The value of adhesion strength from the dispersion characteristic simulation and the value of adhesion force of the nano-scratch test were found to have a similar tendency according to the process variable of the thin film. The results demonstrated that the adhesion strength of a thin film could be evaluated quantitatively by calculating the dispersion characteristics with the adhesion interlayer stiffness model.