Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin

Author:

Ji Dongcan1ORCID,Zhu Yunfan1,Li Min12,Fan Xuanqing12,Zhang Taihua3,Li Yuhang14ORCID

Affiliation:

1. Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China

2. International Innovation Institute, Beihang University (BUAA), Yuhang District, Hangzhou 311115, China

3. Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100094, China

4. Aircraft and Propulsion Laboratory, Ningbo Institute of Technology, Beihang University (BUAA), Ningbo 315100, China

Abstract

The field of electronic skin has received considerable attention due to its extensive potential applications in areas including tactile sensing and health monitoring. With the development of electronic skin devices, electronic skin can be attached to the surface of human skin for long-term health monitoring, which makes comfort an essential factor that cannot be ignored in the design of electronic skin. Therefore, this paper proposes an assessment method for evaluating the comfort of electronic skin based on neurodynamic analysis. The holistic analysis framework encompasses the mechanical model of the skin, the modified Hodgkin–Huxley model for the transduction of stimuli, and the gate control theory for the modulation and perception of pain sensation. The complete process, from mechanical stimulus to the generation of pain perception, is demonstrated. Furthermore, the influence of different factors on pain perception is investigated. Sensation and comfort diagrams are provided to assess the mechanical comfort of electronic skin. The comfort assessment method proposed in this paper provides a theoretical basis when assessing the comfort of electronic skin.

Funder

National Natural Science Foundation of China Joint Fund Project

National Natural Science Foundation of China

Publisher

MDPI AG

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