Electrical and Optical Characterization of SAW Sensors Coated with Parylene C and Their Analysis Using the Coupling-of-Modes (COM) Theory

Author:

Smagin NikolayORCID,Vanotti MeddyORCID,Duquennoy MarcORCID,Rousseau LionelORCID,Alhousseini Hassan,Blondeau-Patissier VirginieORCID,Ouaftouh MohammadiORCID,Valbin Laurie,Herth EtienneORCID

Abstract

In this paper, we present how complementary characterization techniques, such as electrical measurements with a vector network analyzer (VNA), optical measurements with a laser Doppler vibrometer (LDV), and numerical simulations with the finite element method, coupled with spectral domain analysis (FEMSDA), allow us to independently access different properties of a SAW device and fully characterize its operation using the coupling-of-modes theory (COM). A set of chemical SAW sensors coated with parylene C layers of different thicknesses (1, 1.5, and 2 µm) and an uncoated sensor were used as test samples. The sensors represent dual-channel electroacoustic delay lines operating in the vicinity of 77 MHz. The IDTs consist of split aluminum electrodes deposited on a AT-cut quartz substrate. The thickness-dependent influence of the parylene C layer was observed on the operating frequency (SAW velocity), static capacitance, attenuation, crosstalk, and reflection coefficient. COM parameters were reported for the four cases considered; measured and simulated data show good agreement. The presented approach is suitable for the design, characterization, and validation of polymer film-coated SAW sensors.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Exploring Interactions and Properties of the Sodium Carboxymethyl Cellulose–Chitosan Biopolymer Complex;physica status solidi (a);2024-01-26

2. Analysis of SAW Sensor Coated by a Biocompatible Parylen Polymer;2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP);2023-05-28

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