Influence of Carbon Nanowalls Interlayer on Copper Deposition

Abstract

This research deals with the deposition of copper on a steel substrate. Two different methods were investigated: electrochemical and magnetron sputtering. The deposition parameters were optimized to obtain a coating layer with uniform granular structure and good adhesion to the substrate. As a novelty, carbon nanowalls (CNW) were used as reinforcement in copper coatings on the steel surface. The morphology of the coatings, adhesion and Vickers microhardness were performed to emphasize the CNW influence on the coating properties. Open circuit potential and Tafel analysis were used for electrochemical characterization. These kinds of CNW-copper composite with improved hardness and adhesion and surface electrical resistance around 1 Ω·cm could have miscellaneous applications in different domains such as aerospace, electronics, automotive and power-generation.