Interfacial Microstructure and Shear Behavior of the Copper/Q235 Steel/Copper Block Fabricated by Explosive Welding

Author:

Li Jiansheng1ORCID,Xu Zuyuan1,Zhao Yu1,Jiang Wei1,Qin Wenbo2ORCID,Mao Qingzhong3ORCID,Wei Yong1,Wang Banglun1

Affiliation:

1. School of Materials Science and Engineering, Anhui Polytechnic University, Wuhu 241000, China

2. School of Engineering and Technology, China University of Geosciences (Beijing), Beijing 100083, China

3. School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

Abstract

A copper/Q235 steel/copper composite block with excellent bonding interfaces was prepared by explosive welding which was a promising technique to fabricate laminates. The microstructure and mechanical properties of the interfaces were investigated via the tensile-shear test, optical microscope (OM), X-ray diffraction (XRD), scanning electron microscope (SEM), and electron back-scattered diffraction (EBSD). The results showed that the shear strength of the upper-interface and lower-interfaces of the welded copper/steel are higher than ~235 MPa and ~222 MPa, respectively. The specimens failed fully within the copper and not at the bonding interface. It was attributed to: (1) no cavities and cracks at the interface; (2) the interface formed a metallurgical bonding including numerous ultra-fine grains (UFGs) which can significantly improve the plastic deformation coordination at the interface and inhibit the generation of micro-cracks.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Anhui Province

Scientific Research Foundation of Anhui Polytechnic University

Major Research Development Program of Wuhu

Open Research Found of Anhui Key Laboratory of High-performance Non-ferrous Metal Materials

Publisher

MDPI AG

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3