Author:
Wang Xiyou,Cao Sicheng,Lu Guangsheng,Yang Daoguo
Abstract
Three-dimensional-stacked packaging technology is widely used in memory chip packaging, which can greatly increase the utilization ratio of the packaging area. However, problems with the reliability of 3D-stacked packaging are also becoming more and more serious. In this paper, first, a dynamic mechanical analyzer is used to obtain the EMC viscoelasticity parameters. Then, the influence trend of different factors, such as EMC, die bond material and chip, on the performance of the memory chip 3D-stacked packaging under a fixed temperature cyclic loading condition is explored by the FE method.
Funder
Innovation-Driven Development Project of Guangxi Province
Key R & D Plan Project of Guangxi Province
National Natural Science Foundation of China
Guilin Science Research and Technology Development Program
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces