Viscoelastic Simulation of Stress and Warpage for Memory Chip 3D-Stacked Package

Author:

Wang Xiyou,Cao Sicheng,Lu Guangsheng,Yang Daoguo

Abstract

Three-dimensional-stacked packaging technology is widely used in memory chip packaging, which can greatly increase the utilization ratio of the packaging area. However, problems with the reliability of 3D-stacked packaging are also becoming more and more serious. In this paper, first, a dynamic mechanical analyzer is used to obtain the EMC viscoelasticity parameters. Then, the influence trend of different factors, such as EMC, die bond material and chip, on the performance of the memory chip 3D-stacked packaging under a fixed temperature cyclic loading condition is explored by the FE method.

Funder

Innovation-Driven Development Project of Guangxi Province

Key R & D Plan Project of Guangxi Province

National Natural Science Foundation of China

Guilin Science Research and Technology Development Program

Publisher

MDPI AG

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces

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