Design and Fabrication of a Thermopile-Based Thin Film Heat Flux Sensor, Using a Lead—Substrate Integration Method

Abstract

An accurate and continuous measurement of heat flux is needed in many long-term operation facilities in order to monitor and improve the life of its machinery. A thin film heat flux sensor is usually fabricated via sputtering, according to different spatial arrangements of thermocouple junctions. A novel thin film heat flux sensor was designed, fabricated, and calibrated, but the connection between the thin film and the leads could not be fixed quickly and steadily. For this purpose, in this paper a method to seamlessly integrate the leads and the thin film has been proposed to improve the sensor output signal. The sensor is capable of simultaneously measuring surface heat flux and temperature magnitude, to address the current situation of the single design of heat flux sensors. The novel thin film heat flux sensor is structured as follows: Thirty pairs of NiCr-NiSi thermocouple junctions are deposited in an annular pattern on a well-designed ceramic substrate. Over the annular thermopile, a 2000 nm-thick thermal insulator layer is deposited to create a temperature gradient across the layers. In addition, in this study a new calibration method was used to evaluate the static and dynamic properties of this novel thin film heat flux sensor. The analysis and experimental results show that the heat flux calculated from the sensor output was in good agreement with the value obtained from the pre-calibrated standard sensor. The sensitivity and response time of the novel sensor were measured at 0.06 mV/(kW/m2) and 475 ms, respectively. The heat flux measurements made with the sensor presented good repeatability. The heat-transfer coefficient of the Al2O3 thin film was 4.477 w/(m∙k) for the novel thin film heat flux sensor described in this paper.