Fabrication and Characterization of Al2O3-Siloxane Composite Thermal Pads for Thermal Interface Materials

Author:

Kim Seul-Ki12ORCID,Koo Yeong-Jin1,Kim Hyun Sik3,Lee Jong-Keun4,Jeong Kyounghoon45,Lee Younki6ORCID,Jung Eun Young7ORCID

Affiliation:

1. Semiconductor Materials Center, Korea Institute of Ceramic Engineering & and Technology, Jinju 52851, Republic of Korea

2. Department of Materials Engineering, Gyeongsang National University, Jinju 52828, Republic of Korea

3. Analysis and Standards Center, Korea Institute of Ceramic Engineering and Technology, Jinju 52851, Republic of Korea

4. Daehan Ceramics Co., Ltd., Yeongam-gun 58452, Republic of Korea

5. Department of Materials Science and Engineering, Chonnam National University, Gwangju 61186, Republic of Korea

6. Department of Materials Engineering and Convergence Technology, Gyeongsang National University, Jinju 52828, Republic of Korea

7. The Institute of Electronic Technology, College of IT Engineering, Kyungpook National University, Daegu 41566, Republic of Korea

Abstract

In this study, Al2O3–siloxane composite thermal pads were fabricated using a tape–casting technique, and the thermal conductivity effect of the Al2O3 nanoparticle powder synthesized using a flame fusion process on siloxane composite thermal pads was investigated. Furthermore, various case studies were implemented, wherein the synthesized Al2O3 nanoparticle powder was subjected to different surface treatments, including dehydration, decarbonization, and silylation, to obtain Al2O3–siloxane composite thermal pads with high thermal conductivity. The experimental results confirmed that the thermal conductivity of the Al2O3–siloxane composite pads improved when fabricated using surface–treated Al2O3 nanoparticle powder synthesized with an optimally spheroidized crystal structure compared to that produced using non–treated Al2O3 nanoparticle powder. Therefore, this study provides guidelines for fabricating Al2O3–siloxane composite thermal pads with high thermal conductivity in the field of thermal interface materials.

Funder

Ministry of Trade, Industry and Energy, Materials and Components

Publisher

MDPI AG

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3