A Simple Optical Sensor Based on Multimodal Interference Superimposed on Additive Manufacturing for Diameter Measurement

Author:

Cardoso Victor H. R.ORCID,Caldas PauloORCID,Giraldi Maria Thereza R.ORCID,Fernandes Cindy Stella,Frazão Orlando,Costa João C. W. AlbuquerqueORCID,Santos José Luís

Abstract

In many areas, the analysis of a cylindrical structure is necessary, and a form to analyze it is by evaluating the diameter changes. Some areas can be cited: pipelines for oil or gas distribution and radial growth of trees whose diameter changes are directly related to irrigation and the radial expansion since it depends on the water soil deficit. For some species, these radial variations can change in around 5 mm. This paper proposes and experimentally investigates a sensor based on a core diameter mismatch technique for diameter changes measurement. The sensor structure is a combination of a cylindrical piece developed using a 3D printer and a Mach–Zehnder interferometer. The pieces were developed to assist in monitoring the diameter variation. It is formed by splicing an uncoated short section of MMF (Multimode Fiber) between two standard SMFs (Singlemode Fibers) called SMF-MMF-SMF (SMS), where the MMF length is 15 mm. The work is divided into two main parts. Firstly, the sensor was fixed at two points on the first developed piece, and the diameter reduction caused dips or peaks shift of the transmittance spectrum due to curvature and strain influence. The fixation point (FP) distances used are: 5 mm, 10 mm, and 15 mm. Finally, the setup with the best sensitivity was chosen, from first results, to develop another test with an optimization. This optimization is performed in the printed piece where two supports are created so that only the strain influences the sensor. The results showed good sensitivity, reasonable dynamic range, and easy setup reproduction. Therefore, the sensor could be used for diameter variation measurement for proposed applications.

Funder

National Council for Scientific and Technological Development

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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