PDMS-PDMS Micro Channels Filled with Phase-Change Material for Chip Cooling
Author:
Funder
National Natural Science Foundation of China
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
http://www.mdpi.com/2072-666X/9/4/165/pdf
Reference43 articles.
1. Thermal management of electronic devices by composite materials integrated in silicon
2. An Assessment of Direct Chip Cooling Enhancement Using Pin Fins
3. On-chip cooling by superlattice-based thin-film thermoelectrics
4. Microjet cooling devices for thermal management of electronics
5. Chip cooling with integrated carbon nanotube microfin architectures
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