Dynamic Tensile Extrusion Behavior of Fine-Grained Copper Fabricated by Powder Injection Molding

Abstract

The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μm < d < ~10 μm) Cu fabricated by powder injection molding (PIM) were investigated. The FGM Cu was fabricated by PIM with commercial micro-sized Cu powder sintering at 850 °C for 2 h, while the FGH Cu was developed by the hot isostatic pressing (HIP) of the FGM at 780 °C for 2 h under a pressure of 1000 bar. In order to compare the DTE behavior of the FG Cu manufactured using different methods, the ultrafine-grained-B (UFG, d < ~1 μm) Cu was developed by performing 16 passes of equal-channel angular pressing with route Bc, and the FG-150 Cu was fabricated by annealing the UFG-B Cu bar at 150 °C for 1 h. The DTE tests were performed with identical flyer velocities using an all-vacuum gas gun. The fragments and remnants were carefully recovered after the DTE tests and examined by electron backscattered diffraction measurement and a micro-Vickers hardness test. A strong dual <001> + <111> texture was developed during the DTE for both FGM and FGH Cu. In contrast to the outcome of the UFG-B and FG-150, little evidence of dynamic recrystallization taking place during the DTE in the FGM and FGH was found during analysis of the grain morphology and grain orientation spread. Premature failure based on void coalescence was induced at the vertex region of the FGM fragments due to pre-existing pores. The HIP treatment on the FGM Cu increased the relative density by reducing the pre-existing pores and, as a result, increased the DTE ductility of the FGH Cu.